Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate
2006-08-04
2009-11-24
Monbleau, Davienne (Department: 2893)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
C438S124000, C438S666000, C257SE23043, C257SE23085
Reexamination Certificate
active
07622333
ABSTRACT:
A stackable multi-chip package system is provided including forming an external interconnect having a base and a tip, connecting a first integrated circuit die and the base, stacking a second integrated circuit die over the first integrated circuit die in an active side to active side configuration, connecting the second integrated circuit die and the base, and molding the first integrated circuit die, the second integrated circuit die, and the external interconnect partially exposed.
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Kim Young Cheol
Lee Koo Hong
Shim Il Kwon
Yee Jae Hak
Ishimaru Mikio
Monbleau Davienne
Nguyen Dilinh P
Stats Chippac Ltd.
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