Active solid-state devices (e.g. – transistors – solid-state diode – With shielding – With means to shield device contained in housing or package...
Reexamination Certificate
2011-03-08
2011-03-08
Chu, Chris (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
With shielding
With means to shield device contained in housing or package...
C257SE23114, C257S659000, C438S731000
Reexamination Certificate
active
07902644
ABSTRACT:
An integrated circuit package system comprising: providing a lead frame; forming an integrated circuit package including the lead frame; providing a selectively exposed area on the lead frame; and coating a conductive shielding layer on the integrated circuit package for coupling the selectively exposed area.
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Chow Seng Guan
Do Byung Tai
Huang Rui
Kuan Heap Hoe
Chu Chris
Ishimaru Mikio
Stats Chippac Ltd.
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