Integrated circuit package system employing an offset...

Details Integrated circuit package system employing an offset... Integrated circuit package system employing an offset...

2011-01-18

2011-01-18

Clark, Jasmine J (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257SE23006, C257S325000, C257SE25018, C257SE25021, C257SE25027, C257SE23085, C438S109000

Reexamination Certificate

active

07872340

ABSTRACT:
A method for manufacturing an integrated circuit package system includes: providing a base package including a first integrated circuit coupled to a base substrate by an electrical interconnect formed on one side; and mounting an offset package over the base package, the offset package electrically coupled to the base substrate via a system interconnect.

REFERENCES:
patent: 5784261 (1998-07-01), Pedder
patent: 6201266 (2001-03-01), Ohuchi et al.
patent: 6558978 (2003-05-01), McCormick
patent: 6762488 (2004-07-01), Maeda et al.
patent: 6894398 (2005-05-01), Pon
patent: 7008822 (2006-03-01), Bolken et al.
patent: 7053476 (2006-05-01), Karnezos
patent: 7061087 (2006-06-01), Kim
patent: 7132753 (2006-11-01), St. Amand et al.
patent: 7227252 (2007-06-01), Bolken et al.
patent: 7253511 (2007-08-01), Karnezos et al.
patent: 7420269 (2008-09-01), Ha et al.
patent: 7518224 (2009-04-01), Shim et al.
patent: 2005/0230801 (2005-10-01), Kuroda et al.
patent: 2006/0256525 (2006-11-01), Shim et al.
patent: 2007/0001296 (2007-01-01), Lee et al.
patent: 2007/0052082 (2007-03-01), Lee et al.
patent: 2007/0108581 (2007-05-01), Shim et al.
patent: 2008/0157318 (2008-07-01), Chow et al.

Affiliated with

Also associated with

Rating

Integrated circuit package system employing an offset... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Integrated circuit package system employing an offset..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated circuit package system employing an offset... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2659115