Integrated circuit package system

Details Integrated circuit package system Integrated circuit package system

2006-01-31

2009-11-10

Tran, Minh-Loan T (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C257S676000, C257S672000, C257S667000, C257S778000, C257S779000, C257S696000, C257S692000, C257SE33066, C257SE23031, C257SE23043, C257SE23039, C257SE23048, C257SE23061

Reexamination Certificate

active

07615851

ABSTRACT:
An integrated circuit package system comprised by providing a leadframe including leads configured to provide electrical contact between an integrated circuit chip and an external electrical source. Configuring the leads to include outer leads, down set transitional leads, and down set inner leads. Connecting the integrated circuit chip electrically to the down set inner leads. Depositing an encapsulating material to prevent exposure of the down set inner leads.

REFERENCES:
patent: 5428889 (1995-07-01), Mita et al.
patent: 5594234 (1997-01-01), Carter et al.
patent: 5677567 (1997-10-01), Ma et al.
patent: 6080264 (2000-06-01), Ball
patent: 6163076 (2000-12-01), Lee et al.
patent: 6211462 (2001-04-01), Carter et al.
patent: 6225683 (2001-05-01), Yalamanchili et al.
patent: 6427976 (2002-08-01), Huang et al.
patent: 6674154 (2004-01-01), Minamio et al.
patent: 7436049 (2008-10-01), Youn et al.
patent: 2002/0027267 (2002-03-01), Lin et al.
patent: 2002/0132390 (2002-09-01), Harrison et al.
patent: 2003/0020148 (2003-01-01), Kiyohara
patent: 2004/0061202 (2004-04-01), Shim et al.

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