Integrated circuit package substrate with high density...

Details Integrated circuit package substrate with high density... Integrated circuit package substrate with high density...

2005-05-10

2005-05-10

Thai, Luan (Department: 2829)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S698000, C257S700000, C257S774000

Reexamination Certificate

active

06891260

ABSTRACT:
A semiconductor substrate having high density signal routing is provided. The semiconductor substrate may include first signal traces electrically connected to a first row of signal bonding pads and routed on a first layer of the substrate. In addition, the substrate may include second signal traces electrically connected to a second row of signal bonding pads and routed on a second layer of the substrate. The first layer may be arranged in a strip line configuration, and the second layer may be arranged in a micro strip line configuration. Alternatively, the second signal traces may be arranged in a strip line configuration. In an embodiment, the first and second signal traces may be routed as differential pairs with approximately equal trace lengths. In another embodiment, all of the first and second signal traces may be routed as differential pairs.

REFERENCES:
patent: 5530287 (1996-06-01), Currie et al.
patent: 5574630 (1996-11-01), Kresge et al.
patent: 5691568 (1997-11-01), Chou et al.
patent: 5801440 (1998-09-01), Chu et al.
patent: 6137168 (2000-10-01), Kirkman
patent: 6307259 (2001-10-01), Asada et al.

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