Integrated circuit package socket and socket contact

Details Integrated circuit package socket and socket contact Integrated circuit package socket and socket contact

2006-09-12

2006-09-12

Ta, Tho D. (Department: 2833)

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With provision to conduct electricity from panel circuit to...

C439S591000

Reexamination Certificate

active

07104803

ABSTRACT:
An integrated circuit (IC) package socket is provided with an array of single-piece socket contact pins arranged to connect an IC package to a circuit board. The single-piece contact pin is supported at a middle portion of the contact pin and includes two acutely angled bends that allow the two ends of the contact pin to independently resiliently engage the package lands of the IC package and the contact pads of the circuit board. The contact pins are further shaped and arranged to laterally swipe the package lands and contact pads during engagement to scrape away or penetrate through any oxide or other contaminant buildup.

REFERENCES:
patent: 5380210 (1995-01-01), Grabbe et al.
patent: 6186797 (2001-02-01), Wang et al.
patent: 6604950 (2003-08-01), Maldonado et al.
patent: 6877992 (2005-04-01), Grant et al.
patent: 6921270 (2005-07-01), Mendenhall et al.
patent: 6945788 (2005-09-01), Trout et al.
patent: 2002/0048973 (2002-04-01), Zhou et al.
patent: 2004/0253846 (2004-12-01), Brown et al.

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