Cutting – With work immobilizer – Work-stop abutment
Reexamination Certificate
2008-05-06
2008-05-06
Choi, Stephen (Department: 3724)
Cutting
With work immobilizer
Work-stop abutment
C083S468500, C083S929100, C083S953000
Reexamination Certificate
active
11215444
ABSTRACT:
An integrated circuit package separator. A base having a plurality of pins extending upwardly therefrom is provided. A support is provided over the base. The support has an upper surface and a plurality of holes. The pins extend through the holes and upwardly beyond the upper surface of the support. An actuator is provided beneath the support. A board having a plurality of integrated circuits bonded thereto is provided. The integrated circuits form a repeating pattern of integrated circuit packages across the board, and the board has a plurality of holes. The board is placed over the support upper surface with the pins extending into the holes in the board. While the board is over the support upper surface, it is cut to separate the integrated circuit packages. After the cutting, the support is vertically displaced by the actuator to lift the support off the pins.
REFERENCES:
patent: 154694 (1874-09-01), Martin
patent: 1275899 (1918-08-01), Freydberg
patent: 1379724 (1921-05-01), Russell
patent: 2305339 (1942-12-01), Deutscher
patent: 2373968 (1945-04-01), Lang
patent: 3905100 (1975-09-01), Kleine et al.
patent: 3976288 (1976-08-01), Cuomo, Jr.
patent: 4039799 (1977-08-01), Stumpf
patent: 4127432 (1978-11-01), Kuwano et al.
patent: 4497477 (1985-02-01), Abel
patent: 4506442 (1985-03-01), Alzmann et al.
patent: 4807504 (1989-02-01), Vandermarliere
patent: 4822015 (1989-04-01), Glasman et al.
patent: 4832323 (1989-05-01), Principe et al.
patent: 4930759 (1990-06-01), Potter et al.
patent: 5005814 (1991-04-01), Gumbert
patent: 5063800 (1991-11-01), Jung et al.
patent: 5067695 (1991-11-01), Huddleston
patent: 5144873 (1992-09-01), Nasu
patent: RE34125 (1992-11-01), Amos et al.
patent: 5173766 (1992-12-01), Long et al.
patent: 5218753 (1993-06-01), Suzuki et al.
patent: 5288061 (1994-02-01), Pieroni
patent: 5438740 (1995-08-01), Carr et al.
patent: 5480133 (1996-01-01), Motev et al.
patent: 5525261 (1996-06-01), Incorvia et al.
patent: 5628237 (1997-05-01), Lindee et al.
patent: 5765337 (1998-06-01), Lodewegen et al.
patent: 5794329 (1998-08-01), Rossmeisl et al.
patent: 5816089 (1998-10-01), Marando
patent: 5836224 (1998-11-01), Gerber
patent: 5839337 (1998-11-01), Neu
patent: 5932065 (1999-08-01), Mitchell
patent: 5970606 (1999-10-01), Buechele
patent: 5984293 (1999-11-01), Abrahamson et al.
patent: 5988393 (1999-11-01), Hsia et al.
patent: 6034524 (2000-03-01), Barringer et al.
patent: 6124707 (2000-09-01), Kim et al.
patent: 6146504 (2000-11-01), Patadia et al.
patent: 6150240 (2000-11-01), Lee et al.
patent: 6277671 (2001-08-01), Tripard
patent: 6295978 (2001-10-01), Wark et al.
patent: 6356811 (2002-03-01), Beselt
patent: 6540014 (2003-04-01), Getchel et al.
patent: 6701910 (2004-03-01), Roberts
Choi Stephen
Wells St. John P.S.
LandOfFree
Integrated circuit package separators does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Integrated circuit package separators, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated circuit package separators will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3930606