Integrated circuit package separators

Details Integrated circuit package separators Integrated circuit package separators

2008-05-06

2008-05-06

Choi, Stephen (Department: 3724)

Cutting

With work immobilizer

Work-stop abutment

C083S468500, C083S929100, C083S953000

Reexamination Certificate

active

07367252

ABSTRACT:
An integrated circuit package separator. A base having a plurality of pins extending upwardly therefrom is provided. A support is provided over the base. The support has an upper surface and a plurality of holes. The pins extend through the holes and upwardly beyond the upper surface of the support. An actuator is provided beneath the support. A board having a plurality of integrated circuits bonded thereto is provided. The integrated circuits form a repeating pattern of integrated circuit packages across the board, and the board has a plurality of holes. The board is placed over the support upper surface with the pins extending into the holes in the board. While the board is over the support upper surface, it is cut to separate the integrated circuit packages. After the cutting, the support is vertically displaced by the actuator to lift the support off the pins.

REFERENCES:
patent: 154694 (1874-09-01), Martin
patent: 1275899 (1918-08-01), Freydberg
patent: 1379724 (1921-05-01), Russell
patent: 2305339 (1942-12-01), Deutscher
patent: 2373968 (1945-04-01), Lang
patent: 3905100 (1975-09-01), Kleine et al.
patent: 3976288 (1976-08-01), Cuomo, Jr.
patent: 4039799 (1977-08-01), Stumpf
patent: 4127432 (1978-11-01), Kuwano et al.
patent: 4497477 (1985-02-01), Abel
patent: 4506442 (1985-03-01), Alzmann et al.
patent: 4807504 (1989-02-01), Vandermarliere
patent: 4822015 (1989-04-01), Glasman et al.
patent: 4832323 (1989-05-01), Principe et al.
patent: 4930759 (1990-06-01), Potter et al.
patent: 5005814 (1991-04-01), Gumbert
patent: 5063800 (1991-11-01), Jung et al.
patent: 5067695 (1991-11-01), Huddleston
patent: 5144873 (1992-09-01), Nasu
patent: RE34125 (1992-11-01), Amos et al.
patent: 5173766 (1992-12-01), Long et al.
patent: 5218753 (1993-06-01), Suzuki et al.
patent: 5288061 (1994-02-01), Pieroni
patent: 5438740 (1995-08-01), Carr et al.
patent: 5480133 (1996-01-01), Motev et al.
patent: 5525261 (1996-06-01), Incorvia et al.
patent: 5628237 (1997-05-01), Lindee et al.
patent: 5765337 (1998-06-01), Lodewegen et al.
patent: 5794329 (1998-08-01), Rossmeisl et al.
patent: 5816089 (1998-10-01), Marando
patent: 5836224 (1998-11-01), Gerber
patent: 5839337 (1998-11-01), Neu
patent: 5932065 (1999-08-01), Mitchell
patent: 5970606 (1999-10-01), Buechele
patent: 5984293 (1999-11-01), Abrahamson et al.
patent: 5988393 (1999-11-01), Hsia et al.
patent: 6034524 (2000-03-01), Barringer et al.
patent: 6124707 (2000-09-01), Kim et al.
patent: 6146504 (2000-11-01), Patadia et al.
patent: 6150240 (2000-11-01), Lee et al.
patent: 6277671 (2001-08-01), Tripard
patent: 6295978 (2001-10-01), Wark et al.
patent: 6356811 (2002-03-01), Beselt
patent: 6540014 (2003-04-01), Getchel et al.
patent: 6701910 (2004-03-01), Roberts

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