Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate
2007-10-02
2007-10-02
Cao, Phat X. (Department: 2814)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Making plural separate devices
C438S460000, C257SE21599
Reexamination Certificate
active
10774188
ABSTRACT:
An integrated circuit package separator method for separating integrated circuit packages from a board having a plurality of integrated circuits. The method includes providing a base having a plurality of pins, providing a support over the base and having a plurality of holes extending therethrough, the plurality of pins extending through the plurality of holes, vertically displacing the support off the pins using a pair of pneumatic actuators such that each of the pneumatic actuators lift respective opposing ends of the support substantially simultaneously and in unison, providing each of the pneumatic actuators with release valves to equilibrate a back-pressure to ambient during lifting of the support, and separating the integrated circuit packages from one another when the board is over the upper surface of the support.
REFERENCES:
patent: 154694 (1874-09-01), Martin
patent: 1275899 (1918-08-01), Freydberg
patent: 1379724 (1921-05-01), Russell
patent: 2305339 (1942-12-01), Deutscher
patent: 2373968 (1945-04-01), Lang
patent: 3905100 (1975-09-01), Kleine et al.
patent: 3976288 (1976-08-01), Cuomo, Jr.
patent: 4039799 (1977-08-01), Stumpf
patent: 4127432 (1978-11-01), Kuwano et al.
patent: 4497477 (1985-02-01), Abel
patent: 4506442 (1985-03-01), Alzmann et al.
patent: 4807504 (1989-02-01), Vandermarliere
patent: 4822015 (1989-04-01), Glasman et al.
patent: 4832323 (1989-05-01), Principe et al.
patent: 4930759 (1990-06-01), Potter et al.
patent: 5005814 (1991-04-01), Gumbert
patent: 5063800 (1991-11-01), Jung et al.
patent: 5067695 (1991-11-01), Huddleston
patent: 5144873 (1992-09-01), Nasu
patent: RE34125 (1992-11-01), Amos et al.
patent: 5173766 (1992-12-01), Long et al.
patent: 5218753 (1993-06-01), Suzuki et al.
patent: 5288061 (1994-02-01), Pieroni
patent: 5438740 (1995-08-01), Carr et al.
patent: 5480133 (1996-01-01), Motev et al.
patent: 5525261 (1996-06-01), Incorvia et al.
patent: 5765337 (1998-06-01), Lodewegen et al.
patent: 5794329 (1998-08-01), Rossmeisl et al.
patent: 5839337 (1998-11-01), Neu
patent: 5932065 (1999-08-01), Mitchell
patent: 5970606 (1999-10-01), Buechele
patent: 5984293 (1999-11-01), Abrahamson et al.
patent: 5988393 (1999-11-01), Hsia et al.
patent: 6034524 (2000-03-01), Barringer et al.
patent: 6124707 (2000-09-01), Kim et al.
patent: 6146504 (2000-11-01), Patadia et al.
patent: 6150240 (2000-11-01), Lee et al.
patent: 6277671 (2001-08-01), Tripard
patent: 6295978 (2001-10-01), Wark et al.
patent: 6356811 (2002-03-01), Beselt
patent: 6540014 (2003-04-01), Getchel et al.
patent: 6701910 (2004-03-01), Roberts
Cao Phat X.
Kalam Abul
Micro)n Technology, Inc.
Well St. John P.S.
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