Integrated circuit package removal tool

Details Integrated circuit package removal tool Integrated circuit package removal tool

1976-12-16

1977-07-05

Hall, Carl E.

Metal working

Means to assemble or disassemble

Means to disassemble electrical device

29235, 29278, H01R 4300, H05K 1304

Patent

active

040330320

ABSTRACT:
An extraction tool is described for use with integrated circuit (IC) packages of the type having a metallic heat sink member fused to the chip-enclosing ceramic body. The tool finds particular application in connection with a patented high package density island configuration wherein each IC package is secured on a retention post of a connector which is mounted between, and in close proximity to, adjacent parallel sections of the island cooling frame. The IC package heat sink member has at least one integral extension adapted to contact the frame. In performing its removal function, the present tool is capable of gripping opposite edges of the heat sink member in the limited space between the connector and cooling frame section. Having engaged the heat sink, the tool now permits the initial application of opposing forces respectively to the heat sink and the connector retention post. Finally, the opposing forces are directed upon the heat sink member itself, to provide the firm grasp needed for removal of the package from the connector.

REFERENCES:
patent: 3443297 (1969-05-01), Lusby, Jr.
patent: 3974556 (1976-08-01), Kubik

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