Integrated circuit package removal

Metal fusion bonding – With means to remove – compact – or shape applied flux or filler

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

228119, 228264, B23K 100, B23K 302

Patent

active

045615845

ABSTRACT:
An apparatus for removing lap soldered circuit packages from the module to which they are soldered is presented. The module is placed over the apparatus with the circuit package on the underneath side. A nozzle of the apparatus is raised so as to be centered below the circuit package, and a heated gas is directed over the lap soldered leads for a predetermined time. When the solder melts, gravity causes the circuit package to fall away from the module. The falling package is caught and held by the nozzle. The nozzle is then lowered away from the module, and as it is lowered, push rods protrude upwardly through the nozzle to support the circuit package and lift it out of the nozzle, thereby positioning the nozzle for easy and safe handling.

REFERENCES:
patent: 3735911 (1973-05-01), Ward
patent: 3834605 (1974-09-01), Coffin
patent: 3879836 (1975-04-01), Coffin
patent: 4022370 (1977-05-01), Durney
patent: 4441647 (1984-04-01), Holmes

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Integrated circuit package removal does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Integrated circuit package removal, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated circuit package removal will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1020205

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.