Integrated circuit package removal

Details Integrated circuit package removal Integrated circuit package removal

1983-10-17

1985-12-31

Ramsey, Kenneth J.

Metal fusion bonding

With means to remove, compact, or shape applied flux or filler

228119, 228264, B23K 100, B23K 302

Patent

active

045615845

ABSTRACT:
An apparatus for removing lap soldered circuit packages from the module to which they are soldered is presented. The module is placed over the apparatus with the circuit package on the underneath side. A nozzle of the apparatus is raised so as to be centered below the circuit package, and a heated gas is directed over the lap soldered leads for a predetermined time. When the solder melts, gravity causes the circuit package to fall away from the module. The falling package is caught and held by the nozzle. The nozzle is then lowered away from the module, and as it is lowered, push rods protrude upwardly through the nozzle to support the circuit package and lift it out of the nozzle, thereby positioning the nozzle for easy and safe handling.

REFERENCES:
patent: 3735911 (1973-05-01), Ward
patent: 3834605 (1974-09-01), Coffin
patent: 3879836 (1975-04-01), Coffin
patent: 4022370 (1977-05-01), Durney
patent: 4441647 (1984-04-01), Holmes

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