Integrated circuit package provided with cooperatively...

Details Integrated circuit package provided with cooperatively... Integrated circuit package provided with cooperatively...

2006-12-12

2006-12-12

Trinh, Michael (Department: 2822)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Responsive to electromagnetic radiation

C438S056000, C438S064000, C438S106000, C438S123000

Reexamination Certificate

active

07148078

ABSTRACT:
An integrated circuit package includes an angled one-piece substrate having a light source fixed to one area and a sensor die fixed to a second area, such that the light source is directed to illuminate the field of view of the sensor die when a surface of interest is imaged. The integrated circuit package is well suited for generating navigation information regarding movement relative to a surface. In one method of forming the integrated circuit package, the single-piece substrate is originally a generally flat lead frame to which the sensor die and light source are attached. After the components have been connected, the lead frame is bent to provide the desired light source-to-sensor angle. In an alternative method, the lead frame is pre-bent. For either method, optics may be connected to the integrated circuit package, thereby providing a module that includes the optics, the light source, the sensor and the packaging body.

REFERENCES:
patent: 5349371 (1994-09-01), Fong
patent: 5463387 (1995-10-01), Kato
patent: 6292274 (2001-09-01), Bohn
patent: 2002/0080117 (2002-06-01), Son et al.
patent: 2003/0075674 (2003-04-01), Anderson et al.
patent: 2003/0112220 (2003-06-01), Yang et al.
patent: 360035244 (1985-02-01), None

Affiliated with

Also associated with

Rating

Integrated circuit package provided with cooperatively... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Integrated circuit package provided with cooperatively..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated circuit package provided with cooperatively... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3687957