Integrated circuit package on package system

Details Integrated circuit package on package system Integrated circuit package on package system

2011-06-28

2011-06-28

Luu, Chuong A (Department: 2813)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C257S686000, C257SE23141

Reexamination Certificate

active

07968373

ABSTRACT:
An integrated circuit package on package system including: forming a first substrate assembly; forming a second substrate, having an auxiliary access port, supported by the first substrate assembly; exposing an integrated circuit die through the auxiliary access port; and coupling an external integrated circuit on the second substrate.

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patent: 2008/0157319 (2008-07-01), Ha
patent: 2009/0079091 (2009-03-01), Song et al.

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