Active solid-state devices (e.g. – transistors – solid-state diode – Alignment marks
Reexamination Certificate
2008-03-07
2011-11-29
Mandala, Victor A (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Alignment marks
C257S703000, C257SE27130, C257S431000
Reexamination Certificate
active
08067842
ABSTRACT:
The invention relates to the fabrication of integrated circuits in general, and notably the circuits of image sensors intended to form the electronic core of photographic apparatus or cameras. The chip is first aligned with respect to the package and then the package is aligned with respect to the optical system. The alignment of the chip with respect to the package is done optically. The alignment of the package with respect to the system is done mechanically with respect to the edges of the package. According to the invention, provision is made for optical marks to be provided on the package, these marks each having an edge aligned with a lateral edge of the package, so as to minimize the positioning errors which would be due to inaccurate positioning of the chip with respect to the edges of the package.
REFERENCES:
patent: 3869787 (1975-03-01), Umbaugh
patent: 4710250 (1987-12-01), Kojima et al.
patent: 5223746 (1993-06-01), Abe et al.
patent: 5521427 (1996-05-01), Chia et al.
patent: 5861654 (1999-01-01), Johnson
patent: 5878485 (1999-03-01), Wood et al.
patent: 6025728 (2000-02-01), Hembree et al.
patent: 6051784 (2000-04-01), Yoon
patent: 6249049 (2001-06-01), Kamada et al.
patent: 6331452 (2001-12-01), Gall
patent: 6417685 (2002-07-01), Akram et al.
patent: 6486549 (2002-11-01), Chiang
patent: 6617194 (2003-09-01), Shimoe et al.
patent: 6683298 (2004-01-01), Hunter et al.
patent: 6836003 (2004-12-01), Corisis et al.
patent: 7132737 (2006-11-01), Miyazaki
patent: 7327005 (2008-02-01), Brechignac et al.
patent: 7348532 (2008-03-01), Narita et al.
patent: 2002/0048436 (2002-04-01), Nishikawa et al.
patent: 2002/0063974 (2002-05-01), Stern et al.
patent: 2002/0180033 (2002-12-01), Shimoe et al.
patent: 2005/0218513 (2005-10-01), Seko
patent: 2007/0102831 (2007-05-01), Machida et al.
patent: 2008/0284048 (2008-11-01), Kim et al.
patent: 1473777 (2004-11-01), None
patent: 63155648 (1988-06-01), None
patent: 01-217950 (1989-08-01), None
E2V Semiconductors
Harriston William
Lowe Hauptman & Ham & Berner, LLP
Mandala Victor A
LandOfFree
Integrated circuit package, notably for image sensor, and... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Integrated circuit package, notably for image sensor, and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated circuit package, notably for image sensor, and... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4291010