Integrated circuit package including miniature antenna

Details Integrated circuit package including miniature antenna Integrated circuit package including miniature antenna

2006-08-22

2006-08-22

Chen, Shih-Chao (Department: 2821)

Communications: radio wave antennas

Antennas

Microstrip

C343S741000, C343S767000, C343S793000, C343S895000

Reexamination Certificate

active

07095372

ABSTRACT:
The present invention relates to an integrated circuit package comprising at least one substrate, each substrate including at least one layer, at least one semiconductor die, at least one terminal, and an antenna located in the integrated circuit package, but not on said at least one semiconductor die. The conducting pattern comprises a curve having at least five sections or segments, at least three of the sections or segments being shorter than one-tenth of the longest free-space operating wavelength of the antenna, each of the five sections or segments forming a pair of angles with each adjacent segment or section, wherein the smaller angle of each of the four pairs of angles between sections or segments is less than 180° (i.e., no pair of sections or segments define a longer straight segment), wherein at least two of the angles are less than 115°, wherein at least two of the angles are not equal, and wherein the curve fits inside a rectangular area the longest edge of which is shorter than one-fifth of the longest free-space operating wavelength of the antenna.

REFERENCES:
patent: 5710458 (1998-01-01), Iwasaki
patent: 6236366 (2001-05-01), Yamamoto et al.
patent: 6263193 (2001-07-01), Iseki et al.
patent: 6285342 (2001-09-01), Brady et al.
patent: 6320543 (2001-11-01), Ohata et al.
patent: 6373447 (2002-04-01), Rostoker et al.
patent: 6421013 (2002-07-01), Chung
patent: 6424315 (2002-07-01), Glenn et al.
patent: 6611237 (2003-08-01), Smith
patent: 6646609 (2003-11-01), Yuasa et al.
patent: 6710744 (2004-03-01), Morris et al.
patent: 2002/0058539 (2002-05-01), Underbrink et al.
patent: 2004/0014428 (2004-01-01), Franca-Neto
patent: 0978729 (2000-02-01), None
patent: 1085597 (2001-03-01), None
patent: 1126522 (2001-08-01), None
patent: 1326302 (2003-07-01), None
patent: 0154225 (2001-07-01), None
patent: 0096166 (2002-11-01), None
Griffin, Donald W. et al., “Electromagnetic Design Aspects of Packages for Monolithic Microwave Integrated Circuit-Based Arrays with Integrated Antenna Elements”, IEEE Transactions on Antennas and Propagation, vol. 43, No. 9, pp. 927-931, Sep. 1995.
Hall, P.S., “System Applications: The Challenge for Active Integrated Antennas”, The University of Birmingham, Edgbaston, Birmingham, UK, undated (5 pp.).
Kim, Kihong et al., “Integrated Dipole Antennas on Silicon Substrates for Intra-Chip Communication”, IEEE, pp. 1582-1585, 1999.
Papapolymerou, Ioannis et al., “Micromachined Patch Antennas”, IEEE Transactions on Antennas and Propagation, vol. 46, No. 2, pp. 275-283, Feb. 1998.

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