Integrated circuit package-in-package system with carrier...

Details Integrated circuit package-in-package system with carrier... Integrated circuit package-in-package system with carrier...

2007-08-31

2010-02-09

Potter, Roy K (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S723000, C257SE23169, C438S108000, C438S109000

Reexamination Certificate

active

07659609

ABSTRACT:
An integrated circuit package-in-package system includes: mounting an integrated circuit device over a package carrier; forming a subassembly including: providing an integrated circuit package system having a carrier interposer with an integrated circuit die thereover, and mounting a device under the carrier interposer; mounting the subassembly over the integrated circuit device; and encapsulating the subassembly and the integrated circuit device over the package carrier.

REFERENCES:
patent: 6313998 (2001-11-01), Kledzik et al.
patent: 6861288 (2005-03-01), Shim et al.
patent: 6972481 (2005-12-01), Karnezos
patent: 7053476 (2006-05-01), Karnezos
patent: 7064426 (2006-06-01), Karnezos
patent: 7205647 (2007-04-01), Karnezos
patent: 7291926 (2007-11-01), Tao et al.
patent: 7354800 (2008-04-01), Carson
patent: 2004/0061213 (2004-04-01), Karnezos

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