Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2007-08-31
2010-10-12
Potter, Roy K (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257S686000, C257S723000, C257SE23180
Reexamination Certificate
active
07812435
ABSTRACT:
An integrated circuit package-in-package system includes: mounting a first integrated circuit device over a substrate; mounting an integrated circuit package system having an inner encapsulation over the first integrated circuit device with a first offset; mounting a second integrated circuit device over the first integrated circuit device and adjacent to the integrated circuit package system; connecting the integrated circuit package system and the substrate; and forming a package encapsulation as a cover for the first integrated circuit device, the integrated circuit package system, and the second integrated circuit device.
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Ha Jong-Woo
Hong BumJoon
Lee Sang-Ho
Park Soo-San
Ishimaru Mikio
Potter Roy K
Stats Chippac Ltd.
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