Integrated circuit package heat sink attachment

Details Integrated circuit package heat sink attachment Integrated circuit package heat sink attachment

1998-06-23

2000-08-01

Tolin, Gerald

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

H05K 720

Patent

active

060976020

ABSTRACT:
An interface between an integrated circuit package and a heat sink comprises a sandwich of a temperature-induced, solid-to-liquid phase-changing, thermally-conductive material wafer impregnated in a liquid-permeable mounting mesh sheet sandwiched between two pressure-sensitive adhesive frames also impregnating the sheet surrounding the wafer location. The adhesive impregnated sheet frame prevents bleeding of the phase change material out of the space between the integrated circuit package and the heat sink. Methods of making the interface are described.

REFERENCES:
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patent: 5455458 (1995-10-01), Quon
patent: 5545473 (1996-08-01), Ameen
patent: 5591034 (1997-01-01), Ameen
patent: 5945217 (1999-08-01), Hanrahan
Thermoset Quality Resin Formulators, JLS-02-164, Apr. 20, 1998, 1 page.
Tetko, Inc. Precision Woven Screening Media, 1997, 2 pgs.
Furon Thermal Management Solutions for Microprocessors, 1996, Furon Company, New Haven, CT, 10 page catalog.
CPU PAD, Thermally Conductive, Electrically Insulating, Double Coated Tape, The Bergquist Company, Minneapolis, MN, 1996, 2-sided copy of literature.

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