Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate
2007-12-18
2007-12-18
Vu, Hung (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Chip mounted on chip
C257S666000, C257S686000
Reexamination Certificate
active
10463742
ABSTRACT:
Improved approaches to stacking integrated circuit chips within an integrated circuit package are disclosed. The improved approaches enable increased integrated circuit density within integrated circuit packages, yet the resulting integrated circuit packages are thin or low profile. These improved approaches are particularly useful for stacking same size (and often same function) integrated circuit chips with integrated circuit packages. One example of such an integrated circuit package is a non-volatile memory integrated circuit package that contains multiple, like-sized memory storage integrated circuit chips stacked on one or both sides of a leadframe.
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Beyer & Weaver, LLP
SanDisk Corporation
Vu Hung
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