Integrated circuit package having interconnected leads adjacent

Details Integrated circuit package having interconnected leads adjacent Integrated circuit package having interconnected leads adjacent

1982-01-11

1985-04-30

James, Andrew J.

Electricity: conductors and insulators

Feedthrough or bushing

Compression

174 52FP, H01L 2348, H01L 2312

Patent

active

045147507

ABSTRACT:
A package for an integrated circuit is provided with interconnected leads within accessable recesses in the enclosure of the package. The interconnections of the leads is severed to isolate each leads from all other leads.

REFERENCES:
patent: 3617819 (1971-11-01), Boisvert
patent: 3714370 (1973-01-01), Nixen et al.
patent: 4012768 (1977-03-01), Kirk et al.
patent: 4141712 (1979-02-01), Rogers

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