Integrated circuit package having integrated faraday shield

Details Integrated circuit package having integrated faraday shield Integrated circuit package having integrated faraday shield

2008-05-19

2010-06-22

Ngo, Hung V (Department: 2831)

Electricity: conductors and insulators

Anti-inductive structures

Shielded

C361S818000, C257S659000, C257S686000

Reexamination Certificate

active

07741567

ABSTRACT:
A packaged integrated circuit (IC) (100) includes a first substrate (110) including a first plurality of layers and first circuit coupling features (112) at an upper surface of the first substrate (110). The first plurality of layers include a first electromagnetic interference shielding layer (132). The packaged IC also includes a second substrate (106) having an upper surface attached to a lower surface of the first substrate (110) by an electrically conductive adhesive material (136). The second substrate (106) includes a second plurality of layers and a second circuit coupling feature (108) at a lower surface of the second substrate (106). The first plurality of layers includes a second EMI shielding layer (134). The packaged IC further includes a functional die (124) disposed between the first (110) and the second (106) substrates and functionally coupled to the first (112) and/or the second (108) circuit coupling features. In the packaged IC, the adhesive material (136) electrically couples the first (132) and the second (134) shielding layers.

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