Integrated circuit package having heat sink bonded with resinous

Details Integrated circuit package having heat sink bonded with resinous Integrated circuit package having heat sink bonded with resinous

1989-06-12

1990-10-23

Mintel, William

357 71, 357 72, 357 80, H01L 2302

Patent

active

049656600

ABSTRACT:
An integrated circuit package produced by bonding a rear surface of an insulating substrate enclosed in the package to a heat sink such as a cooling fin by a resinous adhesive, which may include one or more fillers, having a Young's modulus of 500 kg/cm.sup.2 or less when formed into a film, has high reliability at the bonding portion and withstands without damages even if subjected to thermal shocks.

REFERENCES:
patent: 2817048 (1957-12-01), Thuermel et al.
patent: 2850687 (1958-09-01), Hammes
patent: 2887628 (1959-05-01), Zierdt, Jr.
patent: 3187226 (1965-06-01), Kates
patent: 4556899 (1985-12-01), Kurihara et al.
patent: 4561010 (1985-12-01), Ogihara et al.
No author, "Thermally Conductive Elastomer for Cooling," IBM Technical Disclosure Bulletin, vol. 28, No. 4, Sep. 1985, p. 1490.

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