Integrated circuit package having an interposer

Details Integrated circuit package having an interposer Integrated circuit package having an interposer

1991-12-27

1994-07-26

Picard, Leo P.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

361736, 361752, 361813, 174 522, 257676, 257700, 257787, H01L 2302, H01L 2328

Patent

active

053328647

ABSTRACT:
An integrated circuit package characterized by an interposer including a thin, flexible, planar insulator having a plurality of substantially radial traces provided on one side thereof. The other side of the insulator is attached to the die attach pad of a lead frame, and an integrated circuit die is attached within a die attach area of the assembly. A first set of wires couples bonding pads of the die to the traces, and a second set of wires couples the traces to bonding fingers of the lead frame. The bonding fingers, interposer, die, and both sets of wires are then encapsulated in plastic. The interposer can be advantageously manufactured in a tape automated bonding (TAB) process to provide a low cost, high performance, and versatile lead frame assembly.

REFERENCES:
patent: 4714952 (1987-12-01), Takekawa et al.

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