Integrated circuit package having a thermoelectric cooling eleme

Details Integrated circuit package having a thermoelectric cooling eleme Integrated circuit package having a thermoelectric cooling eleme

1998-04-01

2000-03-28

Tolin, Gerald

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

62 32, 257930, H05K 720

Patent

active

060439823

ABSTRACT:
A package (10, 60, 80) has a chamber (24) containing an integrated circuit (13) which detects infrared radiation. The package has on one side of the integrated circuit a portion (23) transparent to infrared radiation, and has on the opposite side of the integrated circuit a first part (12) which supports the integrated circuit. A second part (36) of the package is spaced from the first part (12) on the side thereof opposite from the integrated circuit. Thermoelectric cooling elements (51) are provided between and are thermally coupled to the first and second parts. Electrically conductive further elements (44) are also disposed between the first and second parts. A first arrangement (32, 29, 17, 18) electrically couples a terminal on the integrated circuit to a first end of the further element. A second arrangement (41, 38) electrically couples each further element to a respective pad (42) disposed on the side of the second part opposite from the first part. Some of the thermoelectric cooling elements may have one cross-sectional shape, others may have a different cross-sectional shape, and the further elements may have still another cross-sectional shape.

REFERENCES:
patent: 4279292 (1981-07-01), Swiatosz
patent: 5430322 (1995-07-01), Koyanagi
patent: 5515238 (1996-05-01), Fritz
patent: 5637921 (1997-06-01), Borward-Hoy
patent: 5724818 (1998-03-01), Iwata

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