Integrated circuit package having a cooling mechanism

Details Integrated circuit package having a cooling mechanism Integrated circuit package having a cooling mechanism

1992-10-21

1994-07-12

Thompson, Gregory D.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

165 804, 165185, 361704, H05K 720

Patent

active

053294190

ABSTRACT:
An integrated circuit package having a cooling mechanism according to the present invention comprises a plurality of integrated chips disposed to make a matrix and coolers utilizing jet impingement of liquid coolant for cooling which are positioned corresponding to the integrated circuit chips on a printed circuit board using a holding plate and are pressed against the integrated circuit chips with force at a predetermined level. A cooler comprises a cooling plate in contact with a top face of the applicable integrated circuit chip, a cylinder-shaped housing fixed to the cooling plate, a nozzle inserted to the housing to jet the liquid coolant practically to the center of the cooling plate and a draining tube to drain the liquid coolant impinged into the housing. It further comprises a supplying manifold to distribute the liquid coolant supplied from outside to each of the coolers and a draining manifold to collect and drain the liquid coolant flowing from the rows of coolers, and connecting tubes to connect the supplying manifold and the draining manifold with the coolers and to connect adjacent coolers.

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