Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Patent
1988-07-01
1989-09-26
Moses, R. L.
Electricity: conductors and insulators
Boxes and housings
Hermetic sealed envelope type
29827, H01L 2328
Patent
active
048702242
ABSTRACT:
The present invention provides for an apparatus and a method for housing an integrated circuit device. The integrated circuit device is coupled to a ceramic substrate wherein contacts of the integrated circuit device mate with contacts on the substrate surface. Conductive lines then couple the contacts to the peripheral edges of the substrate where one set of ends of a lead frame assembly mates with the conductors. An encapsulation technique is used to encapsulate the device, such that only the other set of ends of the lead frame assembly extends from the package. In an alternative embodiment, the integrated circuit is hermetically sealed by having a hermetic cover disposed over the integrated circuit. In a second alternative embodiment, the substrate is capable of having disposed upon it multiple integrated circuits. The present invention provides for a significant increase of lead count to die size ratio.
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Blish II Richard C.
Brathwaite Nicholas
Dennis Richard
Smith William D.
Intel Corporation
Moses R. L.
Tone D. A.
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