Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate
2008-06-23
2011-11-29
Thai, Luan C (Department: 2891)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
C257SE23020, C257SE23052, C257S676000, C257S691000, C257S692000
Reexamination Certificate
active
08067822
ABSTRACT:
A semiconductor integrated circuit package having a leadframe (108) that includes a leadframe pad (103a) disposed under a die (100) and a bonding metal area (101a) that is disposed over at least two adjacent sides of the die. The increase in the bonding metal area (101a) increases the number of interconnections between the metal area (101a) and the die (100) to reduce the electric resistance and inductance. Furthermore, the surface area of the external terminals radiating from the package's plastic body (106) is increased if not maximized so that heat can be dissipated quicker and external terminal resistances reduced. The integrated circuit is applicable for MOSFET devices and the bonding metal area (101a) is used for the source terminal (101). The bonding metal area may have a “L” shape, a “C” shape, a “J” shape, an “I” shape or any combination thereof.
REFERENCES:
patent: 5457340 (1995-10-01), Templeton et al.
patent: 5519576 (1996-05-01), Moore
patent: 5723899 (1998-03-01), Shin
patent: 6437427 (2002-08-01), Choi
patent: 6545348 (2003-04-01), Takano
patent: 6853059 (2005-02-01), Jang
Bhalla Anup
Chang Mike
Ho Yueh-Se
Lui Sik K.
Luo Leeshawn
Alpha and Omega Semiconductor Incorporated
Cai Jing Ming
Schein & Cai LLP
Thai Luan C
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