Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Patent
1997-09-09
1999-10-05
Kincaid, Kristine
Electricity: conductors and insulators
Boxes and housings
Hermetic sealed envelope type
257680, 257687, 257793, H01L 2302
Patent
active
059628103
ABSTRACT:
An integrated circuit package for EPROM, CCD, and other optical integrated circuit devices has a substrate base having metallized vias extending there through. An integrated circuit die is affixed to a first surface of the substrate, and is electrically connected to the metallized vias. An adhesive bead is applied onto the substrate around the die. The bead covers the side surfaces of the die, the periphery of the upper first surface of the die, and the bond wires. The bead and the upper first surface of the die form a cavity above the die. A layer of a transparent encapsulating material is deposited onto the die, within the cavity formed by the bead. The encapsulating material is hardened, and subsequently forms an exterior surface of the package. The transparent encapsulating material allows light of a selected frequency to illuminate the light sensitive circuitry of the die.
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Amkor Technology Inc.
Kincaid Kristine
MacPherson Alan H.
Ngo Hung V
Parsons James E.
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