Integrated circuit package employing a flexible substrate

Details Integrated circuit package employing a flexible substrate Integrated circuit package employing a flexible substrate

2005-11-28

2010-02-09

Ha, Nathan W (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Beam leads

C257SE21476

Reexamination Certificate

active

07659620

ABSTRACT:
An integrated circuit package includes a flexible laminar substrate1. The substrate1has a flexible layer5of heat conductive material on one of its faces. The layer5extends across an aperture9in the flexible substrate1. A first integrated circuit11is mounted on the layer5within the aperture9, and wire bonded to the substrate1. A flip chip21is mounted on the first integrated circuit11. The two integrated circuits11, 21are embedded in a resin body23.

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