Integrated circuit package electrical enhancement with...

Details Integrated circuit package electrical enhancement with... Integrated circuit package electrical enhancement with...

2006-08-29

2006-08-29

Lee, Eddie (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C257S676000, C257S677000, C257S690000, C257S691000, C257S692000

Reexamination Certificate

active

07098527

ABSTRACT:
A configuration for a conventional lead frame for conserving limited leads and for allowing the location of bond pads anywhere on the periphery of the semiconductor device and for reducing the cost of tooling changes by permitting the use of current tooling. The present invention utilizes an extended lead finger that extends along the periphery of a semiconductor device to provide a power source or ground so that any number of bond pads may be used in any position without requiring additional leads or tooling changes.

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