Integrated circuit package electrical enhancement

Details Integrated circuit package electrical enhancement Integrated circuit package electrical enhancement

1998-03-25

1999-05-25

Williams, Alexander Oscar

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257692, 257676, 257691, 257696, H01L 23495

Patent

active

059071842

ABSTRACT:
A configuration for a conventional lead frame for conserving limited leads and for allowing the location of bond pads anywhere on the periphery of the semiconductor device and for reducing the cost of tooling changes by permitting the use of current tooling. The present invention utilizes an extended lead finger that extends along the periphery of a semiconductor device to provide a power source or ground so that any number of bond pads may be used in any position without requiring additional leads or tooling changes.

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