Integrated circuit package device

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration

Reexamination Certificate

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Details

C257S676000

Reexamination Certificate

active

07064442

ABSTRACT:
The invention relates to integrated circuit package devices including at least two component chips. In particular the invention describes such devices having a transformer provided between the two components chips, the transformer providing isolation between the component chips and wherein the total assembly is sufficiently small that it can be integrated in standard IC packages.

REFERENCES:
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patent: 4360784 (1982-11-01), Bartlett
patent: 4780795 (1988-10-01), Meinel
patent: 5754088 (1998-05-01), Fletcher et al.
patent: 6215816 (2001-04-01), Gillespie et al.
patent: 6249171 (2001-06-01), Yaklin et al.
patent: 6287893 (2001-09-01), Elenius et al.
patent: 6362559 (2002-03-01), Boyd
patent: 2003/0111660 (2003-06-01), Ghamaty et al.
patent: 2004/0094835 (2004-05-01), Maghribi et al.
“iCoupler Digital Isolator; ADuM1100”, Analog Devices, Inc.—Product Datasheet, 2003; pp. 1-14.

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