Integrated circuit package design having an intermediate die-att

Details Integrated circuit package design having an intermediate die-att Integrated circuit package design having an intermediate die-att

1993-06-04

1994-11-15

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174 521, 257666, 257676, 361807, H05K 502

Patent

active

053654099

ABSTRACT:
A package design configuration for an integrated-circuit die includes a leadframe having its bonding fingers connected to the periphery of an electrically-insulated, heat-conductive substrate, formed, for example, of a ceramic material. A number of electrically conductive traces, or bonding islands, serve as intermediate bonding locations for shorter bonding wires connecting bonding pads on the integrated-circuit die to the bonding fingers of the leadframe. The conductive traces serving as bonding islands are formed by deposition of thin-film material using semiconductor fabrication techniques or by deposition of thick-film material using printing techniques. Various shapes and configurations of the conductive traces are available, such as elongated rectangular patterns, or zigzag patterns. Alternatively, the electrically-insulated, heat-conductive ceramic substrate is attached to the die-attach pad of a conventional leadframe.

REFERENCES:
patent: 4489365 (1984-12-01), Daberkoe
patent: 4754317 (1988-06-01), Comstock et al.
patent: 4774635 (1988-09-01), Greenberg et al.
patent: 5213748 (1993-05-01), Biswas et al.
patent: 5227583 (1993-07-01), Jones

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