Integrated circuit package assembly

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

361730, 361732, 361820, 174 524, 174138G, 257685, 257686, 257717, 257730, 257797, 438109, 439525, 439526, H05K 702, H05K 712, H01L 2334

Patent

active

057903816

ABSTRACT:
SIP or ZIP packages are provided with locking elements of snap fasteners, or have package alignment tabs to combine several IC packages into an IC package assembly. Using a DIP printed circuit board socket, a high density DIP module, for example, a high capacity memory chip, is assembled. The leads of the module are inserted into a motherboard that carries the external conductors to be connected with the inner circuits of the package assembly, and soldered to the motherboard. To make the IC package assembly compatible with a conventional DIP socket, a plastic spacer can be provided between the IC packages. A retaining clip may be used to allow the IC package assembly to be repeatedly inserted and removed to and from the socket without the risk of falling apart.

REFERENCES:
patent: 4696525 (1987-09-01), Coller et al.
patent: 4729744 (1988-03-01), Bet et al.
patent: 5128831 (1992-07-01), Fox, III et al.
patent: 5279029 (1994-01-01), Burns
patent: 5287000 (1994-02-01), Takahashi et al.
patent: 5347428 (1994-09-01), Carson et al.
patent: 5377077 (1994-12-01), Burns
patent: 5394010 (1995-02-01), Tazawa et al.
patent: 5616962 (1997-04-01), Ishikawa et al.
patent: 5623395 (1997-04-01), Derouiche et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Integrated circuit package assembly does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Integrated circuit package assembly, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated circuit package assembly will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1184620

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.