Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1997-02-28
1998-08-04
Picard, Leo P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361730, 361732, 361820, 174 524, 174138G, 257685, 257686, 257717, 257730, 257797, 438109, 439525, 439526, H05K 702, H05K 712, H01L 2334
Patent
active
057903816
ABSTRACT:
SIP or ZIP packages are provided with locking elements of snap fasteners, or have package alignment tabs to combine several IC packages into an IC package assembly. Using a DIP printed circuit board socket, a high density DIP module, for example, a high capacity memory chip, is assembled. The leads of the module are inserted into a motherboard that carries the external conductors to be connected with the inner circuits of the package assembly, and soldered to the motherboard. To make the IC package assembly compatible with a conventional DIP socket, a plastic spacer can be provided between the IC packages. A retaining clip may be used to allow the IC package assembly to be repeatedly inserted and removed to and from the socket without the risk of falling apart.
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Derouiche Nour Eddine
Jewler Scott
Mitsubishi Semiconductor America Inc.
Picard Leo P.
Vigushin John B.
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