Integrated circuit package assembly

Details Integrated circuit package assembly Integrated circuit package assembly

1995-12-15

1997-04-22

Sparks, Donald

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174 524, 174138G, 257685, 257686, 257730, 257717, 361730, 361732, 361820, H05K 702, H05K 712, H01L 2302, H01L 2334

Patent

active

056233957

ABSTRACT:
SIP or ZIP packages are provided with locking elements of snap fasteners that allow several packages to be attached to each other to produce an IC package assembly. Using a DIP printed circuit board socket, a high density DIP module, for example, a high capacity memory chip, is assembled. The leads of the module are inserted into a motherboard that carries the external conductors to be connected with the inner circuits of the package assembly, and soldered to the motherboard. To make the IC package assembly compatible with a conventional DIP socket, a plastic spacer can be provided between the IC packages. A retaining clip may be used to allow the IC package assembly to be repeatedly inserted and removed to and from the socket without the risk of falling apart.

REFERENCES:
patent: 4696525 (1987-09-01), Coller et al.
patent: 5128831 (1992-07-01), Fox, III et al.
patent: 5279029 (1994-01-01), Burns
patent: 5287000 (1994-02-01), Takahashi et al.
patent: 5347428 (1994-09-01), Carson et al.
patent: 5377077 (1994-12-01), Burns
patent: 5394010 (1995-02-01), Tazawa et al.

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