Integrated circuit package and seal therefor

Details Integrated circuit package and seal therefor Integrated circuit package and seal therefor

1986-08-04

1987-06-23

Envall, Jr., Roy N.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

361388, 361403, 357 74, 174 52S, H05K 506

Patent

active

046754725

ABSTRACT:
An integrated circuit package having a substrate of ceramic material having a cavity therein, a resilient seal rim connected to the substrate, a lid that may be inserted within said rim and a band of shape-memory alloy surrounding the rim to compress the rim into contact with the lid to seal the package.

REFERENCES:
patent: 3422320 (1969-01-01), Woodling
patent: 3602634 (1971-08-01), Meuli
patent: 3784725 (1974-01-01), Perkins et al.
patent: 4126758 (1978-11-01), Krumme
patent: 4355463 (1982-10-01), Burns

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