Integrated circuit package and process for producing same

Details Integrated circuit package and process for producing same Integrated circuit package and process for producing same

1992-04-15

1994-02-15

Picard, Leo P.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174260, 174262, 427 97, 439 82, H05K 100

Patent

active

052869261

ABSTRACT:
The present integrated circuit package provides both a high density of conductor poles, and reduced crosstalk noise between the conductor poles. The conductor poles are arranged within a selected number of holes in an insulating substrate. Metallized layers for shielding the conductor poles are provided on the walls of the holes in the insulating substrate which receive the conductor poles. In addition, an insulating layer is provided on the inner circumferences of the metallized layers, which insulating layers directly surround the conductor poles to preclude direct contact between the conductor poles and the metallized layers.

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N. Goldberg, "Design of Thin Film Multichip Modules," The International Journal For Hybrid Microelectronics, vol. 4, Oct. 1981, pp. 289-293.
Y. Noguchi et al, "Analysis of Characteristics of the Shielded-Coplanar Waveguide by Conformal Mapping Method," Journal of Electro Communication Society, vol. J60-B, No. 8, 1977, pp. 561-566.
T. Sekiguchi et al, "A Multi-chip Packaged GaAs 16.times.16 Bit Parallel Multiplier," Optoelectronics Laboratories, pp. 1-4.

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