Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate
2005-09-06
2005-09-06
Clark, Jasmine J (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
C257S786000, C257S781000, C257S784000
Reexamination Certificate
active
06940154
ABSTRACT:
The present invention relates to an integrated circuit package and method of manufacturing an integrated circuit package. In one aspect, the present invention relates to an integrated circuit package including a lead frame having a lead with an inner pad and an outer pad connected by a connection member, wherein a region of the inner pad and a region of the outer pad are separated by a channel extending through a width of the lead. Such an integrated circuit package further includes a semiconductor die electrically coupled with the inner pad of the lead, and an encapsulant material encapsulating at least a portion of said lead frame, wherein a portion of said outer pad is exposed. In another aspect, the present invention relates to a method including providing a matrix of lead frames, each of the lead frames having a lead, forming a channel extending through a width of the lead to create an inner pad, an outer pad and a connection member in the lead, electrically coupling a semiconductor die with the inner pad, and encapsulating at least a portion of the lead frame such that at least a portion of the outer pad is exposed.
REFERENCES:
patent: 3908075 (1975-09-01), Jackson et al.
patent: 3942245 (1976-03-01), Jackson et al.
patent: 4501960 (1985-02-01), Jouvet et al.
patent: 4674175 (1987-06-01), Stampfli
patent: 4701781 (1987-10-01), Sankhagowit
patent: 4975765 (1990-12-01), Ackermann et al.
patent: 5023202 (1991-06-01), Long et al.
patent: 5041395 (1991-08-01), Steffen
patent: 5122860 (1992-06-01), Kikuchi et al.
patent: 5157475 (1992-10-01), Yamaguchi
patent: 5172213 (1992-12-01), Zimmerman
patent: 5175612 (1992-12-01), Long et al.
patent: 5221642 (1993-06-01), Burns
patent: 5273938 (1993-12-01), Lin et al.
patent: 5285105 (1994-02-01), Cain
patent: 5334857 (1994-08-01), Mennitt et al.
patent: 5366933 (1994-11-01), Golwalkar et al.
patent: 5420460 (1995-05-01), Massingill
patent: 5474957 (1995-12-01), Urushima
patent: 5482736 (1996-01-01), Glenn et al.
patent: 5482898 (1996-01-01), Marrs
patent: 5485037 (1996-01-01), Marrs
patent: 5556807 (1996-09-01), Bhattacharyya et al.
patent: 5596231 (1997-01-01), Combs
patent: 5596485 (1997-01-01), Glenn et al.
patent: 5620928 (1997-04-01), Lee et al.
patent: 5672909 (1997-09-01), Glenn et al.
patent: 5679978 (1997-10-01), Kawahara et al.
patent: 5693572 (1997-12-01), Bond et al.
patent: 5769589 (1998-06-01), Lubbers
patent: 5796163 (1998-08-01), Glenn et al.
patent: 5801927 (1998-09-01), Watanabe
patent: 5847455 (1998-12-01), Manteghi
patent: 5854511 (1998-12-01), Shin et al.
patent: 5867368 (1999-02-01), Glenn
patent: 5886397 (1999-03-01), Ewer
patent: 5894108 (1999-04-01), Mostafazadeh et al.
patent: 5900676 (1999-05-01), Kweon et al.
patent: 5903052 (1999-05-01), Chen et al.
patent: 5939784 (1999-08-01), Glenn
patent: 5949655 (1999-09-01), Glenn
patent: 5950074 (1999-09-01), Glenn et al.
patent: 5962810 (1999-10-01), Glenn
patent: 5973388 (1999-10-01), Chew et al.
patent: 5981314 (1999-11-01), Glenn et al.
patent: 6011694 (2000-01-01), Hirakawa
patent: 6034429 (2000-03-01), Glenn et al.
patent: 6040984 (2000-03-01), Hirakawa
patent: 6081029 (2000-06-01), Yamaguchi
patent: 6091603 (2000-07-01), Daves et al.
patent: 6092281 (2000-07-01), Glenn
patent: 6104086 (2000-08-01), Ichikawa et al.
patent: 6117193 (2000-09-01), Glenn
patent: 6117705 (2000-09-01), Glenn et al.
patent: 6143588 (2000-11-01), Glenn
patent: 6143981 (2000-11-01), Glenn
patent: 6150193 (2000-11-01), Glenn
patent: 6198163 (2001-03-01), Crowley et al.
patent: 6201292 (2001-03-01), Yagi et al.
patent: 6214644 (2001-04-01), Glenn
patent: 6228676 (2001-05-01), Glenn et al.
patent: 6229200 (2001-05-01), Mclellan et al.
patent: 6236568 (2001-05-01), Lai et al.
patent: 6239496 (2001-05-01), Asada
patent: 6242281 (2001-06-01), Mclellan et al.
patent: 6246566 (2001-06-01), Glenn
patent: 6258629 (2001-07-01), Niones et al.
patent: 6265771 (2001-07-01), Ference et al.
patent: 6266197 (2001-07-01), Glenn et al.
patent: 6274927 (2001-08-01), Glenn
patent: 6281241 (2001-08-01), Elsner
patent: 6281568 (2001-08-01), Glenn et al.
patent: 6285075 (2001-09-01), Combs et al.
patent: 6291884 (2001-09-01), Glenn et al.
patent: 6294100 (2001-09-01), Fan et al.
patent: 6294830 (2001-09-01), Fjelstad
patent: 6307755 (2001-10-01), Williams et al.
patent: 6326678 (2001-12-01), Karnezos et al.
patent: 6395578 (2002-05-01), Shin et al.
patent: 6396143 (2002-05-01), Kimbara et al.
patent: 6429048 (2002-08-01), McLellan et al.
patent: 6429508 (2002-08-01), Gang
patent: 6433360 (2002-08-01), R. Dosdos et al.
patent: 6444498 (2002-09-01), Huang et al.
patent: 6452255 (2002-09-01), Bayan et al.
patent: 6458626 (2002-10-01), Huang et al.
patent: 6498099 (2002-12-01), McLellan et al.
patent: 6507102 (2003-01-01), Juskey et al.
patent: 6545347 (2003-04-01), McClellan
patent: 6552417 (2003-04-01), Combs
patent: 6566740 (2003-05-01), Yasunaga et al.
patent: 6638790 (2003-10-01), Minamio et al.
patent: 2002/0079570 (2002-06-01), Ho et al.
patent: 2 609 841 (1987-01-01), None
patent: 3-198368 (1991-08-01), None
US 5,905,304, 5/1999, Ewer et al. (withdrawn)
English Translation of JP Laid Open Patent Application No. 3-198368 (3 pages).
English Translation of French Publication No. 2 609 871 (14 pages).
U.S. Appl. No. 09/902,878 filed Jul. 11, 2001 by Combs et al.
U.S. Provisional Appl. No. 60/312,411 filed Aug. 15, 2001 by McLellan et al.
U.S. Appl. No. 10/062,650 filed Jan. 31, 2002 by McLellan et al.
U.S. Appl. No. 10/062,896 filed Jan. 31, 2002 by Pedron et al.
U.S. Appl. No. 10/104,263 filed Mar. 22, 2002 by Combs et al.
McLellan Neil Robert
Pedron Serafin
Yee Lin Tsui
ASAT Limited
Clark Jasmine J
Milbank Tweed Hadley McCloy
LandOfFree
Integrated circuit package and method of manufacturing the... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Integrated circuit package and method of manufacturing the..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated circuit package and method of manufacturing the... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3439725