Integrated circuit package and method of making the same

Details Integrated circuit package and method of making the same Integrated circuit package and method of making the same

1994-10-18

1996-11-26

Jackson, Jr., Jerome

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

257787, H01L 23495

Patent

active

055788718

ABSTRACT:
A leadframe strip is provided with a die pad and a protrusion is formed on the die pad so as to project from the rear side thereof. An integrated circuit chip is bonded to the front side of the die pad and is connected by leads to portions of the leadframe strip adjacent the die pad. The die pad, chip and leads are placed in a mold and an epoxy is injected into the mold to encapsulate the die pad, chip and leads. The protrusion spaces the die pad from the internal mold surface confronting the rear side of the die pad.

REFERENCES:
patent: 4803540 (1989-02-01), Moyer et al.
patent: 5389739 (1995-02-01), Mills
Licari, J. J.; "Plastic Coatings for Electronics", pp. 14-23, and 278-313, 1971.

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