Integrated circuit package and method having wire-bonded...

Details Integrated circuit package and method having wire-bonded... Integrated circuit package and method having wire-bonded...

2007-02-06

2007-02-06

Andujar, Leonardo (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S723000, C257S688000, C438S107000, C438S117000

Reexamination Certificate

active

10819684

ABSTRACT:
A semiconductor package having a substrate mounted die. The die configured having active circuit components and a top surface having bond pads electrically connected with circuitry of the die. The bond pads commonly being formed above active circuit components. The bond pads being electrically interconnected with wire bonds to establish intra-chip electrical connection between circuitry of the die. Methods of forming such packages are also disclosed.

REFERENCES:
patent: 5371405 (1994-12-01), Kagawa
patent: 6087721 (2000-07-01), Akhnoukh et al.
patent: 6351010 (2002-02-01), Yamanaka et al.
patent: 6424034 (2002-07-01), Ahn et al.
patent: 2002/0176239 (2002-11-01), Schoenbom

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