Integrated circuit package and lead frame

Details Integrated circuit package and lead frame Integrated circuit package and lead frame

1979-09-04

1981-09-15

Rubinson, Gene Z.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

357 70, 361421, H05K 502

Patent

active

042899222

ABSTRACT:
An improved integrated circuit ceramic package meeting JEDEC-11 standards and having a nominal pin (lead) count of from 24 to 156. Control measures and assembly procedures referenced to the precise center of the die-attach area provide closer dimensional control and lead coplanarity which facilitate automatic die-attach and wire-bonding operations. A lead frame is provided with both diagonal and axial (X-Y) registration points, and internal and external lead tie-bars. It is precisely attached in special tools to a ceramic cover element, and the internal tie bars are sheared off. The cover sub-assembly is then secured to a ceramic base in similar tools. Devitrification of the sealing glass follows. The external tie bars form a convenient carrier protecting the leads, and the registration points provide precise siting for die-attach and wire bonding.

REFERENCES:
patent: 3676748 (1972-07-01), Kobayashi et al.
patent: 3689683 (1972-09-01), Paletto et al.
patent: 4079511 (1978-03-01), Grabbe
patent: 4089733 (1978-05-01), Zimmerman

Affiliated with

Also associated with

Rating

Integrated circuit package and lead frame does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Integrated circuit package and lead frame, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated circuit package and lead frame will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-391932