Integrated circuit package and compact assemblies thereof

Details Integrated circuit package and compact assemblies thereof Integrated circuit package and compact assemblies thereof

1990-09-24

1991-08-27

Hille, Rolf

357 75, 357 81, 357 80, H01L 2312, H01L 2314, H01L 2332

Patent

active

050437941

ABSTRACT:
In accordance with the present invention, an integrated circuit package comprises a thermally conductive plate for receiving an integrated circuit and an open rectangular structure of conductor and insulator for surrounding the sides of the circuit and presenting one or more linear arrays of conductive connectors extending laterally through the rectangular structure. Preferably the rectangular structure also includes transverse contacts. Advantageously the plate includes extensions beyond the rectangular structure for acting as cooling fins on opposing sides of the rectangular structure. The linear arrays and cooling fins are preferably on different pairs of parallel sides.

REFERENCES:
patent: 4631572 (1986-12-01), Zimmerman
patent: 4638348 (1987-01-01), Brown et al.
patent: 4654694 (1987-03-01), Val
patent: 4879588 (1989-11-01), Ohsuka et al.
patent: 4890153 (1989-12-01), Wu
patent: 4894706 (1990-01-01), Sato et al.
patent: 4953005 (1990-08-01), Carlson
patent: 4956694 (1990-09-01), Eide

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