Integrated circuit package and assembly thereof

Details Integrated circuit package and assembly thereof Integrated circuit package and assembly thereof

2007-04-24

2007-04-24

Potter, Roy (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S738000

Reexamination Certificate

active

11073447

ABSTRACT:
An integrated circuit (IC) package and IC assembly. The IC assembly comprises the IC package, an insulating substrate and an adhesive film. The IC package comprises a chip body and a plurality of bumps. The bumps are disposed on a first surface of the chip body, each bump having a patterned pressing surface. The insulating substrate comprises a plurality of electrode pads corresponding to the bumps. Each electrode pad has a second surface pressed on the pressing surface of each bump. The adhesive film is disposed between the IC package and the insulating substrate, for covering the bumps and the electrode pads.

REFERENCES:
patent: 5487999 (1996-01-01), Farnworth
patent: 6162652 (2000-12-01), Dass et al.
patent: 6344753 (2002-02-01), Takada et al.
patent: 6518781 (2003-02-01), Masuda
patent: WO2004001839 (2003-12-01), None

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