Integrated circuit package

Details Integrated circuit package Integrated circuit package

1995-06-06

1997-05-13

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

257721, 257722, H01L 2334

Patent

active

056295600

ABSTRACT:
The integrated circuit package includes a package body, an integrated circuit chip enclosed airtight in the package body, a lead provided at a lower portion of the package body for connecting the integrated circuit chip to an external circuit, and air blasting means for cooling the package body by forced air cooling. The package body has, at an upper portion thereof, a heat radiation region formed from a fin and an air blasting region in which the air blasting means is disposed. A ventilation flue is formed between the heat radiation region and the air blasting region. This package is particularly superior in its heat radiation properties.

REFERENCES:
patent: 5132780 (1992-07-01), Higgins, III
patent: 5198889 (1993-03-01), Hisano et al.
IBM Technical Disclosure Bulletin, vol. 34, No. 7B, Dec. 1991, pp.321-322.

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