Electricity: conductors and insulators – Feedthrough or bushing – Compression
Patent
1981-01-15
1984-04-03
Edlow, Martin H.
Electricity: conductors and insulators
Feedthrough or bushing
Compression
357 80, 174 52S, H01L 2302, H01L 3902, H02G 1308
Patent
active
044411197
DESCRIPTION:
BRIEF SUMMARY
TECHNICAL FIELD
The present invention relates generally to a package for a semiconductor device, and more particularly to an integrated circuit package having pin and socket connections integrally formed therein.
BACKGROUND ART
Integrated circuit (IC) chips are typically enclosed in packages to provide environmental and mechanical protection as well as electrical connection with a circuit board or other components. Such packages have generally included a body of nonconductive material with external lead pins by which the chip encased therein can be connected to a circuit board.
A substantial portion of the cost and size of a packaged chip is attributable to its package, and two important design criteria in addition to providing a reliable electrical connection are cost effectiveness and space efficiency. Further, it is generally desirable to design such packages for quick and easy disconnection to facilitate testing and replacement.
It will be appreciated that many electronic applications require functional cooperation between two or more IC chips. For example, microprocessor chips with the desired program logic contained therein are often utilized in conjunction with erasable programmable read only memory (EPROM) chips containing stored parameters which can be erased by ultraviolet light and reprogrammed with new parameters as necessary. A window must be provided in the package of the EPROM chip for transmission of the ultraviolet light. It is of course possible to combine the functions of a microprocessor and EPROM into a single monolithic integrated circuit and package, however, this has proven to be quite expensive due to the low chip per wafer yield associated with the manufacture of semiconductor devices and the relatively low production rates of such monolithic chips.
Although integrated circuit packages are not usually adapted for such, recently there have been efforts to adapt such packages for stacking to achieve greater circuit board density and space efficiency. For example, my copending application Ser. No. 053,879 discloses and claims an integrated semiconductor package capable of supporting separately packaged semiconductors. The supporting or base chip is interconnected electrically to lead pins and socket contacts by means of conductive circuitry compatible with other semiconductor packages. Even these packages, however, have tended to be expensive due to the additional components and manufacturing steps involved in their fabrication.
A need thus exists for an improved semiconductor package having pin and socket connections integrally formed therein for plug-in compatability with circuit boards and other semiconductors.
SUMMARY OF INVENTION
The present invention comprises an integrated circuit package which overcomes the foregoing and other difficulties associated with the prior art. In accordance with the invention, there is provided a semiconductor package comprised of a bottom pin subassembly, an intermediate socket subassembly and an upper socket cover. The pin subassembly includes a nonconductive body formed around a lead frame defining external lead pins and internal bonding fingers. The socket subassembly includes a nonconductive body formed around a lead frame defining external socket contacts and internal bonding fingers. The pin and socket subassemblies define a cavity for the semiconductor chip which in turn is wire bonded to the internal bonding fingers thereof. The external socket contacts of the socket subassembly are adapted to cooperate with openings in the cover to define integral socket connections for receiving lead pins from another semiconductor package or other electrical component. The external lead pins of the pin subassembly provide the connection by which the package can be plugged into a circuit board or the like.
BRIEF DESCRIPTION OF DRAWINGS
A better understanding of the invention can be had by reference to the following Detailed Description in conjunction with the accopanying Drawings, wherein:
FIG. 1 is a perspective exploded view of the integrated
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Badgett J. L.
Edlow Martin H.
Mostek Corporation
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