Integrated circuit package

Details Integrated circuit package Integrated circuit package

2009-02-12

2011-11-01

Cao, Phat (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Electromagnetic or particle radiation

C257S434000, C257S680000

Reexamination Certificate

active

08049290

ABSTRACT:
Package (1) having a sensor assembly (2) with at least one sensitive surface (21) and an attachment surface (22), a carrier element (3) with a sensor attachment area (31), and a sensor attach material (4) for attaching the sensor assembly (2) to the sensor attachment area (31) of the carrier element. The package (1) comprises an encapsulation (5) of a first material, in which the encapsulation (5) covers the sensor attachment area (31) of the carrier element (3) and the sensor attach material (4) and leaves the at least one sensitive surface (21) free from the first material.

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patent: 2007/017301 (2007-02-01), None
C. Cotofana et al., “Low-cost plastic sensor packaging using the open-window package concept”, Sensors and Actuators A, May 15, 1998, pp. 185-190, vol. 67, Elsevier Sequoia S.A.
Extended European Search Report, dated Jul. 21, 2008 and issued in corresponding European Patent Application No. 08151407.7-1236 .

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