Integrated circuit package

Details Integrated circuit package Integrated circuit package

2008-02-08

2011-10-04

Dickey, Thomas L (Department: 2893)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257SE21499

Reexamination Certificate

active

08030746

ABSTRACT:
An integrated circuit package includes a substrate and a first semiconductor chip. The first semiconductor chip is provided in a cavity on a first side of the substrate. The package further includes a second semiconductor chip provided on a second side of the substrate. The first semiconductor chip and the second semiconductor chip form a stack.

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