Integrated circuit package

Details Integrated circuit package Integrated circuit package

2005-11-16

2010-06-01

Lee, Eugene (Department: 2891)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S109000, C438S613000, C257S685000, C257SE21499, C228S180220, C029S830000, C029S831000

Reexamination Certificate

active

07727799

ABSTRACT:
Two integrated circuits1, 3, 101, 103having circuitry on one of their major surfaces11, 31, 111, 131are ground on their opposite major surfaces13, 33to reduce their thickness. The ground integrated circuits are then adhered together to form a composite body7and placed in a chamber97, 197formed within a substrate9, 109such as a printed circuit board. Electrical connections are formed between contacts15, 35, 115, 135of the integrated circuits1, 3, 101, 103and contacts92, 192of the substrate9, 109. Components22may be mounted on the outer surfaces24of the substrate9, 109.

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Quirk et al., Semiconductor Manufacturing Technology, Prentice Hall, 2001, p. 574.

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