Integrated circuit package

Details Integrated circuit package Integrated circuit package

2007-12-20

2009-11-17

Thai, Luan C (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C257S673000, C257S678000, C257S723000, C257S777000, C257SE23039, C257SE23043, C257SE23045

Reexamination Certificate

active

07619303

ABSTRACT:
An integrated circuit package is described that includes two dice. The active surface of each die includes a plurality of I/O pads. The active surface of the first die is positioned adjacent first surfaces of the leads of a lead frame such that I/O pads from the first die are arranged adjacent corresponding solder pad surfaces on the first surfaces. Similarly, the active surface of the second die is positioned adjacent second surfaces of the leads opposite the first surfaces such that I/O pads from the second die are arranged adjacent corresponding solder pad surfaces on the second surfaces. A plurality of solder joints are arranged to physically and electrically connect I/O pads from the first or second die to associated adjacent solder pad surfaces on the leads. In this way, a single lead frame can be utilized to package two dice, one on either side of the leads of the leadframe.

REFERENCES:
patent: 5596225 (1997-01-01), Mathew et al.
patent: 5677567 (1997-10-01), Ma et al.
patent: 6080264 (2000-06-01), Ball
patent: 6184573 (2001-02-01), Pu
patent: 6204554 (2001-03-01), Ewer et al.
patent: 6353257 (2002-03-01), Huang
patent: 6388336 (2002-05-01), Venkateshwaran et al.
patent: 6424024 (2002-07-01), Shih et al.
patent: 6518161 (2003-02-01), Rajagopalan et al.
patent: 6577012 (2003-06-01), Greenwood et al.
patent: 6593545 (2003-07-01), Greenwood et al.
patent: 6700189 (2004-03-01), Shibata et al.
patent: 6750546 (2004-06-01), Villanueva et al.
patent: 6798044 (2004-09-01), Joshi
patent: 6927483 (2005-08-01), Lee et al.
patent: 6953988 (2005-10-01), Seo et al.
patent: 7067904 (2006-06-01), Wang et al.
patent: 7164202 (2007-01-01), Wang et al.
patent: 7250685 (2007-07-01), Shim et al.
patent: 7253508 (2007-08-01), Liu et al.
patent: 2002/0093093 (2002-07-01), Paek
patent: 2003/0071344 (2003-04-01), Matsuzawa et al.
patent: 2003/0155634 (2003-08-01), Yasunaga et al.
patent: 2005/0156296 (2005-07-01), Wang et al.
patent: 2005/0167855 (2005-08-01), Minamio et al.
patent: 2005/0224945 (2005-10-01), Saito et al.
patent: 2006/0105501 (2006-05-01), Kuah et al.
Office Action in U.S. Appl. No. 11/936,017, dated Apr. 3, 2009.
U.S. Appl. No. 11/691,429, filed Mar. 26, 2007.
Office Action in U.S. Appl. No. 11/691,429, dated Nov. 28, 2008.
Final Office Action in U.S. Appl. No. 11/691,429, dated Jun. 1, 2009.
U.S. Appl. No. 11/936,017, filed Nov. 6, 2007.
Office Action dated Oct. 1, 2009 in U.S. Appl. No. 11/691,429.

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