Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2007-06-05
2007-06-05
Thomas, Tom (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257S690000, C257S208000, C257S210000, C257S503000, C257S781000, C257S782000, C257S773000, C257S784000, C257S786000, C257S648000, C438S618000, C438S666000
Reexamination Certificate
active
10114625
ABSTRACT:
A packaged IC includes an IC die with signal and signal complement traces positioned relative to each other to maximize broadside coupling for a matching impedance. The signal and signal complement traces are electrically connected to transmission or receive channels of the IC die. Use of a broadside coupled trace configuration alleviates routing congestion in an IC package and permits an IC to accommodate a greater number of channels within a given surface area than is possible under the prior art.
REFERENCES:
David M. Pozar, Microwave Engineering, Power Dividers and Directional Coupler, Chapter 7 (1998).
Barnes James Oliver
Devnani Nurwati S
Lai Benny W H
Moore Charles E
Agilent Technologie,s Inc.
Im Junghwa
Thomas Tom
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